first phone with visible flowing water shows the liquid cooling technology in redmagic 11 pro

Redmagic 11 pro smartphone cools down with flowing water

Redmagic unveils the 11 Pro smartphone, which uses visible flowing water as its liquid cooling technology to keep the device’s temperature low. To be released starting November 3rd, 2025, the gadget places a plate named Aqua Core within the device. Here, the customized micro pumps inside the sheet circulate liquid coolant throughout the micro channels. It is not an animation but an actual water stream that moves through the plate and is on full display at the back of the Redmagic 11 Pro smartphone. This entire plate with visible flowing water is embedded inside the frame of the device, allowing the system to fend off the heat from when gamers use the gadget heavily.

This is the first time that Redmagic is using flowing water as its liquid cooling technology for its recent smartphone, the 11 Pro. The company introduced the first smartphone to include a built-in fan in 2019 in the name of Redmagic 3. The fan works with the internal components to move hot air away from the processor during high-performance gaming, keeping the temperature stable, and this marked the start of Redmagic’s ongoing work in thermal design.

all images courtesy of Redmagic

Upgraded cooling-down design from liquid metal

There’s also the ICE-X system, which is the Redmagic’s main thermal management structure that combines several layers of materials and components designed to control and distribute heat. These layers include a vapor chamber, copper plates, graphene sheets, and a turbo fan. The vapor chamber moves heat away from the chip through evaporation and condensation. Graphene, a conductive carbon material, spreads heat evenly across the surface. Copper plates serve as insulation and assist in transferring heat to the outer shell. The fan forces air through the chamber, moving warm air out and drawing cooler air in, and this setup allows the company’s smartphones to maintain performance under long gaming sessions, particularly in the previous models.

A major development came to the team with the arrival of the Redmagic 10 Pro, which introduced a solid-state liquid metal alloy inside the ICE-X system. This alloy bumps up the thermal conductivity, meaning heat travels faster from the processor to the cooling layers (liquid metal is used in a solid form to improve stability and reduce leakage risk). In the REDMAGIC 10S Pro, the engineers modified the formula of Liquid Metal 2.0 to make it slightly more solid and stable, allowing the material to be placed directly over the main processing chip and improving the heat transfer and lowering CPU temperatures by about 5°C compared to the previous model. Starting November 3rd, 2025, an upgrade is set to arrive with Aqua Core, using flowing water as the new face of the company’s ongoing liquid cooling research, embedded inside the recent Redmagic 11 Pro smartphone.

view of Aqua Core, the plate with water stream within